Hi Ryan! There has been a tremendous amount of published data on both
immersion tin and immersion silver qualification in the last two years. The
APEX 2000 proceedings, the last two IPCWorks proceedings (1999, 2000), and
the IPC Irvine Surface Finishes conference proceedings (1999) would be 4
sources I know which contain papers. Are you planning on conducting basic
qualification testing or something more specific to how the finishes
function in your processes?

Dave Hillman
Rockwell Collins
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Ryan Grant <[log in to unmask]>@IPC.ORG> on 12/20/2000 09:38:19 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
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Subject:  [TN] immersion silver and tin qual


        Hi All,

        I've just been given an open ticket to conduct a surface finish
qual
for immersion silver and immersion tin.  Anybody have suggestions about
what
aspect of the finish to test?

        The surface will be used at SMT, thru-hole, press fit, and ICT
(test
points).  (No wirebonding or contacts).  Edge plating may be necessary for
certain designs that ground the board to the chassis by sliding the board
into fingered slots.

        We are looking for a replacement of immersion gold, but don't want
to deal with the assembly issues with HASL or OSP.

        What I would like most is maintaining solderability WITHOUT taking
special precautions.  (At least, no more than must be done with gold).

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
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