Hi All,

        I've just been given an open ticket to conduct a surface finish qual
for immersion silver and immersion tin.  Anybody have suggestions about what
aspect of the finish to test?

        The surface will be used at SMT, thru-hole, press fit, and ICT (test
points).  (No wirebonding or contacts).  Edge plating may be necessary for
certain designs that ground the board to the chassis by sliding the board
into fingered slots.

        We are looking for a replacement of immersion gold, but don't want
to deal with the assembly issues with HASL or OSP.

        What I would like most is maintaining solderability WITHOUT taking
special precautions.  (At least, no more than must be done with gold).

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]

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