I have always been taught that you should always look at the component spec
to see what it tells you.  Requirement we see in the documents we use to
solder or accept with are based in a lot of cases from component specs.
Remember what we accept on incoming will not get an any better at the
output.  "Garbage in Garbage out".  I not saying everything is the latter
but it is a good thing to remember at all stages of the soldering processes
or really any processes.

I remember the box capacitors that had problems with soldering near the body
due to exposed copper (from the testing of the component at the component
manufacture) that would not solder.  The component spec stated somewhere
that solderability was not to be expected within (I think/I remember) .040"
of the body.  My 2 cents worth.

I do not know all of you personally but it has been great through this forum
to know you are not alone in this world of electronics and our daily issues.

To all a very Merry Christmas and a Happy New Year.

Jon

 -----Original Message-----
From:   Dennis Manowski [mailto:[log in to unmask]]
Sent:   Tuesday, December 19, 2000 8:52 AM
To:     [log in to unmask]
Subject:        [TN] Bare Edges - Preplated Contacts

Hello Folks:

In IPC-A-610, Section 10.2.7 "J Leads", there is
special dispensation given to permit the absence of
side fillets by design such as in the case of leads
made from preplated material (bare edges). We
currently have a component supplier that manufactures
a thru-hole part for us that is made from preplated
material and the wetting action on the cut sides has
come into question. No actual joint failures of any
kind have ever been reported but inspection continues
to denote these as a "non-conformance".

Does anyone know of any standards or guidelines for
this type of condition on a thu-hole part ?

Thanks,

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