Hi all,
This is great idea to get vias plugged from both sides.
What are the working techniques for this?I presume all of us know how to do
it from one side,but from both sides?
Any practical ideas??
Happy X-mass and Hannukah ( this year this is the same time) for evebody
Edward

Edward Szpruch
Eltek , Manager of Process Engineering
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9395050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]

> -----Original Message-----
> From: Alain Savard [SMTP:[log in to unmask]]
> Sent: ג דצמבר 19 2000 19:37
> To:   [log in to unmask]
> Subject:      Re: [TN] OSP PROCESS
> 
> Hi all,
> 
> I haven't looked at plugging on one side for OSP before, but it doesn't
> sound like a good idea. Plugged vias have a tendency to entrap chemicals
> (from ANY of the subsequent process).  These chemicals can thereafter go
> right through the OSP (which typically does not provide very good long
> term
> corrosion protection at any rate) and corrode the material of the vias.
> For
> OSP, I would definitely suggest plugging on both sides or not at all.
> 
> Just my 2 cents (that's 3 cents in Canadian money)!
> 
> Happy holidays,
> 
> Alain Savard, B.Sc.
> Chemical Process Analyst
> CAE Electronics Ltd.
> e-mail: [log in to unmask]
> 
> 
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: December 19, 2000 10:53 AM
> To: [log in to unmask]
> Subject: [TN] OSP PROCESS
> 
> 
>  Season's Greetings to All
> On boards with plugged vias (one side only) that have an OSP coating, does
> the
> OSP coating go on Before or After the solder mask plugging?
> 
> We have boards with corroded holes that I am told have the vias plugged,
> then
> the board goes through a dilute sulphuric acid microetch, followed by OSP.
> 
> Doesn't seem a like a real good idea to me!!
> 
> Susan Mansilla
> Robisan Lab
> 
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