Presently we are having a thermally challenging situation:

On a 8-layer FR4 board, we have mounted six identical 27-mm flip chip BGAs
with 672 solder balls each. The distance between each BGA is 20 mm. These
BGAs have AlSiC heat spreader. In the system, the same two boards are
inserted in parallel and separated by only 14mm space. When used, the
devices will not function properly due to high junction temperature. We
are thinking of using heat sinks to help dissipate heat so that these
devices can function properly. With such space restriction (14 mm between
two boards), can anyone recommend a heat sink which can be used? Another
concern is the efficiency of forced airflow in such a narrow space, any
comments?

Thanks,


Yuan

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