TECHNET Archives

December 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Dec 2000 13:18:48 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (43 lines)
Hi Mike - we do limited solderability testing on incoming materials.
Product - commercial and military avionics in a high mix, low volume type
of manufacturing environment. Solderability testing done per JSTD-002A.

Dave Hillman
Rockwell Collins
[log in to unmask]




Mike Sewell <[log in to unmask]>@IPC.ORG> on 12/14/2000 09:09:23 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to [log in to unmask]

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] Solderability Testing


If I may, I'd like a quick poll of those of you who do solderability
testing
on incoming material.  Please also give your manufacturing enviroment -
volume, mix, commercial or aerospace.

Regards,
Mike Sewell


---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2