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December 2000

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Subject:
From:
"<Erik de Kluizenaar>" <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Thu, 14 Dec 2000 10:07:27 +0100
Content-Type:
text/plain
Parts/Attachments:
Dear Jack, John, dear all,

It is possible that you get this posting for a second time, but I resend it to besure because I got a message that is was rejected by the server.

Jack McCullen Wrote:
" No material used in the package can have lead intentionally added.  Lead can be present as an impurity at <0.1%
This is the proposal by HDPUG and a survey of about 30 companies all agreed OK."
John Lynch wrote:
" Defining Pb-Free ;
        From a components perspective, what would be the WEEE definition of Pb-free??
        a)100% Pb elimination
        b)Pb below 1000ppm
        c)no external Pb ( means die attach could have Pb/Sn slder)" 
        d)other"

My reaction:
I think that this is one of the big issues that is open for development and lobbying in Brussels for the coming years. Somewhere in the present draft WEEE it is stated that Annex II (the list of exemptions) will have to be fixed by, say, 2004, and that 
we have to learn what should be in there during the period in between. So, to some extent it is up to us, technically involved people, to show what is feasible and what is wise or stupid. My feeling is that in DG-XI they have understood already that some 
components (like power semiconductor devices with large silicon chips) will have to contain high-lead-content solders, also in the future because there are and probably will be no alternatives available. (Whatever agreements on paper, these will not 
provide technical solutions to this problem.)
The WEEE draft states that such efforts should be stimulated. This implies in practice, that it should be possible for EU-based companies and institutes to get work on this aspect subsidised.

With best regards, 
Erik

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Erik E. de Kluizenaar
PHILIPS CFT - Electronic Packaging & Joining (EP&J)
Building SAQ-p,  p/o box 218,  5600 MD Eindhoven - The Netherlands
Tel/Fax: (+31 40 27) 36679/36815;    E:mail  [log in to unmask]
PHILIPS homepage:  http://www.philips.com; PHILIPS CFT homepage: http://www.cft.philips.com
Internal PHILIPS only:   http://pww.cft.philips.com/cfteurope/electronics/elpajo/index.htm
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