Pondering some recent postings on this forum, I began questioning some
of the assertions that eliminating lead is feasible. Specifically, I
wondered about the current inability (or, at least, lack of rating) of
many parts to survive temperatures in the 260°C range (many larger
ceramic capacitors, for example, are not warranted to survive immersion
in solder above approximately 230°C for even a few seconds). If lead is
removed from solder, the components will be required to survive at 260°C
or higher for quite a large number of seconds.

If the components can be made to tolerate higher temperatures without
degradation when new solder(s) with higher melting temperature(s) are
introduced, why haven't component manufacturers already made their
devices more robust?

Jim Smith
Managing Director
Cambridge Management Sciences, Inc.
4285 45th St. S.
St. Petersburg, FL 33711-4431
Tel: (727)866-6502 ext. 21
Fax: (727)867-7890
eMail: [log in to unmask]

---------------------------------------------------------------------------------
Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------