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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 7 Dec 2000 17:48:09 -0600 |
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Rick, please check IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices. Hard copies are available through IPC Customer Service 847.790.5362. Jack
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Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL 60062-6135
[log in to unmask]
847-790-5393
fax 847-509-9798
>>> [log in to unmask] 12/07/00 04:21PM >>>
I need some opinions on re-sealing moisture sensitive components. Like many
places, we have a procedure covering the handling of moisture sensitive
devices. It includes provisions for re-sealing opened bags of components
with dessicant, etc. Recently our manufacturing manager has been allowing
the use of the metalized anti-static bags used for PCBA packaging to be used
to seal components instead of the heavier metalized bags the components
originally come in. I don't believe this is sufficient protection, but I'd
like opinions either way. Am I over reacting or should we not allow this
type of bag for re-sealing devices?
Thanks in advance,
Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065
+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]
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