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Wed, 27 Dec 2000 20:23:05 EST |
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Hi Michael,
For appropriate accelerated reliability tests go to documents IPC-SM-785,
Guidelines for Accelerated Reliability Testing of Surface Mount Solder
Attachments, for performance qualification use IPC-9701, Performance Test
Methods and Qualification Requirements for Surface Mount Solder Attachments
(currently in Official Proposal form), and for good reliability design
IPC-D-279, Design Guidelines for Reliable Surface Mount Technology Printed
Board Assemblies.
'Bump pull' tests and the like only confirm quality, but do not assure
reliability.
Werner Engelmaier
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