DESIGNERCOUNCIL Archives

December 2000

DesignerCouncil@IPC.ORG
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Sender:
DesignerCouncil <[log in to unmask]>
X-To:
Mark Gutierrez <[log in to unmask]>
Date:
Tue, 12 Dec 2000 15:15:05 -0600
Reply-To:
Chris Robertson <[log in to unmask]>
Subject:
Re: Thermal relief for Vias?
From:
Chris Robertson <[log in to unmask]>
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multipart/alternative; boundary="----=_NextPart_000_0028_01C0644E.4E48E280"
Organization:
Lockheed Martin
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1.0
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