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Tue, 12 Dec 2000 11:36:08 +0100 |
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Dear Mrs. / Mr.
I'm looking for adhesive design rules for SMD packages that are suitable
for wave solder application.
For the definition of DFM parameters in our CAE system, I would like to
know the dot size, dot location etc. per SMD package for a stencil
printing process and/or Dispensing process.
Taking in account the repairability of the SMD, without damaging the
printed circuit board.
Who can help me with info about this subject.
--
Best Regards,
Marius Geurts
Manufacturing Quality Engineer Electronics
Research & Development
Oce Technologies B.V.
The Netherlands
IPC member
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