I've been asked if I can evaluate and identify the amount a part will float in
the 'z' direction during reflow solder. We are using a small surface mount
connector in a phone application and the z axis must be very tightly controlled
for mating purposes. Anyone have any ideas where to find information on this
topic?
Thanks in advance,
Patrick Tussey
Hughes Network Systems
---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------