Mark:
Our manufacturing folks want thermals on BGA vias.  They say removal of the
part for rework is much harder if all the ground/power vias are connected
directly to the plane.

--
George Patrick
Tektronix, Inc.
Central Engineering,  M/S 39-512
P.O. Box 500
Beaverton, OR 97077-0001
Phone: 503-627-5272    Fax: 503-627-5587



-----Original Message-----
From: Mark Gutierrez [mailto:[log in to unmask]]
Sent: Tuesday, December 12, 2000 09:23
To: [log in to unmask]
Subject: [DC] Thermal relief for Vias?


Someone here suggested that all vias connected to power and ground planes
should have the thermal relief's eliminated. Reason to
minimize inductance to power planes. I recall reading somewhere about
removing thermals could induce reliability problems. Can anyone share their
knowledge and experience with this?. IPC-2221 specifies thermal relief is
only required for holes that are subject to soldering in large conductor
areas. Wouldn't this apply to a via tied to a plane coming off a SMD land?

Mark Gutierrez


Mark Gutierrez

Senior Printed Circuit Designer

Blaze Network Products Inc.

5180 Hacienda Drive

Dublin, CA 94568

email: [log in to unmask] <mailto:[log in to unmask]>

www.blazenp.com <http://www.blazenp.com/>

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