I have several question regarding ENIG. First we have some customers that
require immersion gold that is not required to be gold wire bondable. We now
have another customer that requires gold wire bond ability and as you might
know due to the thin gold plating it does not pass gold wire bonding. My
question is if there is one process that will do both? I understand that to
be gold wire bondable we need to increase the thickness of the gold plating
or can we add a palladium process prior to the gold plating and pass gold
wire bonding. I have also been told that there are those that say they
actually have an electro less gold process and would like to get anyone's
experience that have worked with it. How stable and what is operating cost
and supplier. What do other do when faced with bondable requirements and non
bondable requirements?

Thanks

Scott

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