Dear Technetters,
                Has anyone seen the following problem or can give any guidance to
overcome it?

After drilling we process FR4, BT epoxy, Polyimide, and ptfe replacement
laminates through solvent swell, desmear. neutralise, Shadow direct
plate and  copper electroplate with never a problem. When we process
Isola materials with Tg,s of 150, 160 and 170 Deg.C we get voids in the
plated holes. The three materials are all of the same generic type.

Thanks in advance

Roger

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