As there are a lot of microwave guys out there also, I take the opportunity
to ask following: small PIN diode chip (round bond area < 75 mil dia )
AuSn'ed  on CuMo heatspreader. For withstanding maximum current we parallel
many 25 micron bond wires. Now, the bond gold is only some 1 micron thick,
and I have a feeling that many out there use to presolder a metal stud
firstly onto the chip, and THEN make wirebonding on that stud. This way you
gain two purposes: spread current more evenly from bond wires into p+  and
get better wire bonding conditions. Q: if there is someone making same way,
what studs do you mount and who sells them?

Sorry for such faraway q from copper and epoxy, but need some help.
Typically for Creswick and like...

Tx>advance

Ingemar Hernefjord
Ericsson Microwave Systems

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