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November 2000

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Nov 2000 08:35:58 -0500
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Is there a concern of tin whisker growth with the white tin process?  How
does this differ than plain old tin plating?

Thanks,
Jim M.


        -----Original Message-----
        From:   Franklin D Asbell [SMTP:[log in to unmask]]
        Sent:   Monday, November 06, 2000 7:20 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] Board Whit Tin finish

        Scott,

        The immersion 'white' tin process is not as costly to maintain as a
        nickel/gold process. When properly maintained the finish applied to
        surface mount pads will be excellent for solderability even after a
        short shelf-life (3 - 6 months) if the product is packaged
        appropriately.

        It is compatible with component finishes and I've never heard of it
        being incompatible with available assembly processes. One thing to
        consider also, handling after the immersion process. Here we handle
the
        product as though it were an OSP process including slip-sheets,
        individual bagged when necessary, dessicant packaged to protect from
        moisture...etc...etc...

        Hope this helps.

        Franklin


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