Scott,

The immersion 'white' tin process is not as costly to maintain as a
nickel/gold process. When properly maintained the finish applied to
surface mount pads will be excellent for solderability even after a
short shelf-life (3 - 6 months) if the product is packaged
appropriately.

It is compatible with component finishes and I've never heard of it
being incompatible with available assembly processes. One thing to
consider also, handling after the immersion process. Here we handle the
product as though it were an OSP process including slip-sheets,
individual bagged when necessary, dessicant packaged to protect from
moisture...etc...etc...

Hope this helps.

Franklin

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------