How about solder?

Brian

An Gielen wrote:
>
> Technetters,
>
> Does anyone know what kind of technologies are
> available for filling
>  blind micro vias with a diameter of 25-50 µm ?
> The technologies I am aware of use screenprinting of a
> conductive
> paste or a plating in the micro via after applying a resist
> layer. Are
>  there any other technologies?
>
> Thanks for your time and energy.
>
> An Gielen
> e-mail:[log in to unmask]
>
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