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November 2000

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Subject:
Technologies for filling blind micro vias
From:
An Gielen <[log in to unmask]>
Reply To:
[log in to unmask], [log in to unmask]
Date:
Sat, 4 Nov 2000 18:03:30 +0100
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Technetters,

Does anyone know what kind of technologies are
available for filling
 blind micro vias with a diameter of 25-50 µm ?
The technologies I am aware of use screenprinting of a
conductive
paste or a plating in the micro via after applying a resist
layer. Are
 there any other technologies?

Thanks for your time and energy.

An Gielen
e-mail:[log in to unmask]

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