Here it is.
Good luck
Kang
>From: "Pelkey, Glenn" <[log in to unmask]>
>Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, "Pelkey, Glenn"
><[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Temperature Cycle to product life
>Date: Thu, 30 Nov 2000 09:20:34 -0800
>
>Hi Lee, Werner,
>
> That "B" version was not easy to find. I couldn't find it on the
>Jedec website or one of two document resellers. The reseller that did have
>it shows it was issued 7/00/00 (interesting date). "A" version only goes
>to
>section 4.0, so I'm looking forward to the revision.
>
>Glenn
>
> > -----Original Message-----
> > From: Werner Engelmaier [SMTP:[log in to unmask]]
> > Sent: Wednesday, November 29, 2000 6:20 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Temperature Cycle to product life
> >
> > Hi Lee,
> > You are quoting the wrong part of the JEDEC Standard. According to JEDEC
> > Test
> > Method, JESD22-A104-B, Section 5.7.2 warns specifically against high
>ramp
> > rates for solder joint testing.
> >
> > Werner Engelmaier
> > Engelmaier Associates, L.C.
> > Electronic Packaging, Interconnection and Reliability Consulting
> > 7 Jasmine Run
> > Ormond Beach, FL 32174 USA
> > Phone: 904-437-8747, Fax: 904-437-8737
> > E-mail: [log in to unmask], Website: www.engelmaier.com
> >
>
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