Hi Lee, Werner,

        That "B" version was not easy to find.  I couldn't find it on the
Jedec website or one of two document resellers.  The reseller that did have
it shows it was issued 7/00/00 (interesting date).  "A" version only goes to
section 4.0, so I'm looking forward to the revision.

Glenn

> -----Original Message-----
> From: Werner Engelmaier [SMTP:[log in to unmask]]
> Sent: Wednesday, November 29, 2000 6:20 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Temperature Cycle to product life
>
> Hi Lee,
> You are quoting the wrong part of the JEDEC Standard. According to JEDEC
> Test
> Method, JESD22-A104-B, Section 5.7.2 warns specifically against high ramp
> rates for solder joint testing.
>
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL  32174  USA
> Phone: 904-437-8747, Fax: 904-437-8737
> E-mail: [log in to unmask], Website: www.engelmaier.com
>

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