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November 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 30 Nov 2000 09:08:41 EST
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In a message dated 11/30/2000 6:54:13 AM Central Standard Time, 
[log in to unmask] writes:

> Good morning everyone!
>  
>  Can anyone tell me if there is an industry standard for temperature and
>  humidity levels for an electronics production floor? I believe the
>  recommended minimum relative humidity level under a good ESD program is 
40%.
>  We are looking to monitor the temperature and humidity levels in our new
>  building but I am unsure of what the upper and lower acceptable limits
>  should be.  Please advise.
>  
>  (Please note: as of now we are looking to treat the entire production floor
>  as a controlled environment, however in the new building the shipping doors
>  are only blocked by those "shipping drapes" which means when they are open
>  the outside temperature could play a role in changing the inside
>  temperature.)
>  
>  Rich

Hi Rich!

The J-STD-001 states:

3.7.1 Environmental Controls
The soldering facility should be enclosed, temperature and humidity 
controlled, and
maintained at a positive pressure.

3.7.2 Temperature and Humidity
When humidity decreases to a level of 30% or lower, the manufacturer shall 
verify that electrostatic discharge control is adequate, and that sufficient 
moisture is present for flux performance and solder paste applications. For 
operator comfort and solderability maintenance, the temperature should be 
maintained between 18º C. and 30º C. and the relative humidity should not 
exceed 70%. For process control, more restrictive temperature and humidity 
limits may be required.

-Steve Gregory-

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