Hello Shirley,
As far as I know, 7628 (R/C:43%) is never allow between copper foil and
laminate.
For mobile phone key board, I had encountered one case that
customer require 0.010" thin core with 1.0mm final thickness. Then I
have to use 7630 (R/C:49%) prepreg to hit customer requirements. But
the unfavorable things of using 7630 is thickness after lamination is
difficult to control with the tight final thickness tolerance.
But we have reach customer requirement at last.
Hope this help!

Benjamin

Wednesday, November 29, 2000, 7:20:04 PM, you wrote:

SX>   My friend pass me another question. I hope someone
SX> can give some inputs.
SX>   The application is a mobile phone keypad (gold
SX> plated), Motorola's engineer insists that it is not
SX> acceptable if we can see the patten of glass fabric.
SX> The microsection shows there is no weave exposure or
SX> weave texture(use 0.014" H/H laminate,construction is
SX> 2 ply of 7628)
SX>   1. Is it true that the circuit board surface is more
SX> rough if we use 7628?
SX>   2. What can do to improve the surface quality? Use
SX> 2116 instead of 7628 or modify the resin content of
SX> 7628 prepreg?
SX>   3. Is there any related specification?

SX>   Thanks in advance!
SX>   Shirley


SX> __________________________________________________
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--
Best regards,
 Benjamin                            mailto:[log in to unmask]

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