 
| Subject: | |
| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 29 Nov 2000 19:56:22 +0800 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Shirley:
My $0.02:
1. Surprised that you're using 7628 on a mobile phone. These are normally
thinnish boards, so 7628 would not be our first choice of dielectric.
2. Theory is: 7628 shouldn't be used next to outer layers, as the thick weave
may cause uneven copper surface and ugly weave exposure-like phenomena. It
shouldn't be used next to a lot of inner layers either, as its low resin content
doesn't fill copper-free areas very well. Did the customer approve use of 7628?
3. 2116 would be better, or 2125. Is build not specified?
4. I don't think there are any relevant specifications, but experience works
quite well. Fact is, 7628 is a filler, and should be used sparingly, on low-cost
applications.
And who do you work for? You're hiding behind Yahoo!
Good luck.
Michael
-----原始郵件-----
寄件者: Shirley Xiao <[log in to unmask]>
收件者: [log in to unmask] <[log in to unmask]>
日期: Wednesday, November 29, 2000 19:44
主旨: [TN] Gold Plating Roughness of Mobile phone keypad
| My friend pass me another question. I hope someone
|can give some inputs.
| The application is a mobile phone keypad (gold
|plated), Motorola's engineer insists that it is not
|acceptable if we can see the patten of glass fabric.
|The microsection shows there is no weave exposure or
|weave texture(use 0.014" H/H laminate,construction is
|2 ply of 7628)
| 1. Is it true that the circuit board surface is more
|rough if we use 7628?
| 2. What can do to improve the surface quality? Use
|2116 instead of 7628 or modify the resin content of
|7628 prepreg?
| 3. Is there any related specification?
|
| Thanks in advance!
| Shirley
|
|
|__________________________________________________
|Do You Yahoo!?
|Yahoo! Shopping - Thousands of Stores. Millions of Products.
|http://shopping.yahoo.com/
|
|-------------------------------------------------------------------------------
--
|Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
|To unsubscribe, send a message to [log in to unmask] with following text in
|the BODY (NOT the subject field): SIGNOFF Technet
|Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
|Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
|information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
|-------------------------------------------------------------------------------
--
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|
