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November 2000

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Subject:
From:
Miguel Vallejo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 28 Nov 2000 13:53:25 -0800
Content-Type:
text/plain
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text/plain (45 lines)
I'm currently experiencing poor wetting on chips with Palladium finish, and
was about to post a request for advise, perhaps the profile control limits
are to be tighter than with Ni/Sn finishes. Can anybody help?
Are there any special procedures to achieve good wetting on these lead
finishes?

> ----------
> From:         Lisa Anderson[SMTP:[log in to unmask]]
> Sent:         Tuesday, November 28, 2000 11:29 AM
> To:   [log in to unmask]
> Subject:      [TN] 95Sn/5Pb Tinned leads
>
> Question to the forum:
>
> Has anyone experienced problems regarding solderability of component
> leads tinned with 95Sn/5Pb solder?
>
> Many thanks for your input,
>
> lba
>
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