There are 2 types of bumps popular: 95Pb5Sn and 63Pb37Sn. If I would
choose one for my flip chip packages, which one would be a better choice.
Assume thta my die is above 20 mm. Could anyone enlighten me in terms of
reliability, based on intermetallic diffusion, UBM,  solder material creep
and crack resistance etc.? Regards,

Yuan Li

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