TECHNET Archives

November 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ron Waugh <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 2 Nov 2000 08:27:33 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines)
     Technetters,

     I have a huge problem with the wetting and solderability of a fine
     pitch 15 mil QFP.  I then spoke with the solder supplier; which
     requested a couple of the components and performed x-sections.  During
     the x-sections, they also performed a metal composition of the
     components lead.  The metal in the leads turned out to be alloy 42,
     which is ....non-wetting???? ...."or so I'm told".

     I really don't know much about metals but the solder supplier stated
     that the component will never wet properly.  I would really like to
     get some literature on this alloy 42 and ask if anyone else has had
     any of these problems and what was their fix.

     Thanks in advance for your time and energy.

     Regards,

     Ron Waugh
     Process Engineer
     Diversified Systems, Inc.
     Phone: (317) 299-9547 Ext. #336
     Fax:  (317) 298-2055
     Email: [log in to unmask]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2