The product of interest is a surface mount solder joints on flex. Thanks.

----- Original Message -----
From: Lou Hart <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, November 22, 2000 10:54 PM
Subject: Re: [TN] Temperature Cycle to product life


David, trying to echo what Brian said, what is the product?  An IC wire
bond?  Backplane?  Assembly with surface mount solder joints?  People have
asked me about the main challenge for the reliability profession these days.
I think the most difficult one is the development of credible accelerated
hardware tests, since that would involve stressing in extreme lab
environments for relatively long times along with collection of operational
data over even longer times.  (I'm staying away from questions about
software quality and reliability.)  Best of luck.

I've struggled with your question many times.  I believe there is value in
environmental stress screening, which may involve thermal cycling as you
describe (or a milder version), to eliminate "weak" product.  In fact, I've
speculated that "bad" solder joints may be culled out by stress screening,
while "good" ones are not degraded any more than they would be in a day or
two of normal operation.  Any comments from the knowledgable would be of
interest.

Lou Hart
Compunetix
(ASQ Certified Reliability Engineer)

----------
From:   David[SMTP:[log in to unmask]]
Sent:   Wednesday, November 22, 2000 8:48 PM
To:     [log in to unmask]
Subject:        [TN] Temperature Cycle to product life

<<File: ATT00012.htm>>
Hi,

Would like reliability opinions on temperature cycle translating to a
product life. For a temp cycle at the following parameters:
-55 to 125 degC
5 mins dwell time on each peak
Maximum ramp at 10degC/min

What would this translate to a product life for 100cycles, 200 cycles and
300 cycles?

Thanks.

Best regards,
David.

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