Thanks Jerry:
It was the Pad on the BGA itself that came off. We did reballing once in awhile in the proto
line, but this is the first time the pads came right off after the reballed part went through
the reflow oven. I believe it was the heat from the touch-up cleaning process casue the pad
deliminated from the part. But again we did that all the time.
Jeff Ferry wrote:
> Glenn,
>
> Thanks for the reference. I'm not sure if Ryu needs to replace a pad on the
> BGA component, or board surface, but we detail the following on our web
> site:
>
> Surface Mount, BGA Pad Repair, Film Adhesive Method
> http://www.circuittechctr.com/guides/4-7-3.htm
>
> Surface Mount, BGA Pad with Integral Via Repair
> http://www.circuittechctr.com/guides/4-7-4.htm
>
> Hope this helps,
>
> Jeff Ferry
> CEO
> Circuit Technology Center
> www.circuittechctr.com
>
> Chairman
> IPC Rerpairability Committee
>
> On Wed, 1 Nov 2000 15:02:14 -0800, Pelkey, Glenn <[log in to unmask]>
> wrote:
>
> >Check out this article...may be useful. No personal experience with it.
> >
> >Glenn
> >
> >"The case of the Missing Surface-Mount Pads," J. Ferry. Circuits Assembly,
> >June 2000.
> >
> >htttp://www.circuitsassembly.com
> >
> >> -----Original Message-----
> >> From: Ryu [SMTP:[log in to unmask]]
> >> Sent: Wednesday, November 01, 2000 8:20 AM
> >> To: [log in to unmask]
> >> Subject: [TN] Is it possible to repair BGA pad?
> >>
> >> During a reballing process, we accidentally removed a pad from the BGA
> >> substrate in the cleaning
> >> process. Is there any reliable method to attach the pad back to the
> >> substrate? or should we
> >> re-use the part at all. Thanks .
> >
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