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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 21 Nov 2000 07:59:04 -0800 |
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hi,
as you are probably well aware, steam aging is a test that tells you something about the shelf life of a finished surface in a relatively short amount of time. your problem is correlating the test parameters to your local conditions (storage time, temperature, humidity). if you store your boards in a vacuum environment, a steam aging test probably would be of no use to you. if you store your bare boards in a warehouse with an uncontrolled, tropical environment, a steam age test would be valuable.
a second problem you will face is getting your pwb fabricator to accept this test.
your procurement drawing could specify an exception to this 'tin/tin-lead, only' condition for j-std-003 if that is what you want to do.
phil
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, November 21, 2000 4:39 AM
To: [log in to unmask]
Subject: [TN] Fw:Steam Aging
Dear Technetters,
For IPC-J-STD-003, the solderability test after steam aging is only for tin and tin/lead coatings board. Why is this? For other coatings board, say gold or silver, do the test have the mean? If have, how can I do the test? Where can I find the description about these? Please tell me. Thanks!
Best Regards,
>
> Albert Lai
> E-MAIL : [log in to unmask] <mailto:[log in to unmask]>
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