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November 2000

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Subject:
Re: BGA Soldering Problem
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Nov 2000 08:13:34 -0600
Content-Type:
text/plain
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text/plain (19 lines) 
Several times had unstripped solder mask/resist remain in holes preventing
solderability, but not in the way you describe.

Also, had legend ink/resist applied in assembly house not cure and do what
you describe during rework. The ink was an LPI type and the assemblers used
it to cover dogbones that had been scuffed during solder wicking activities
and didn't cure it properly.

Earl Moon

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