Glenn,
Thanks for the reference. I'm not sure if Ryu needs to replace a pad on the
BGA component, or board surface, but we detail the following on our web
site:
Surface Mount, BGA Pad Repair, Film Adhesive Method
http://www.circuittechctr.com/guides/4-7-3.htm
Surface Mount, BGA Pad with Integral Via Repair
http://www.circuittechctr.com/guides/4-7-4.htm
Hope this helps,
Jeff Ferry
CEO
Circuit Technology Center
www.circuittechctr.com
Chairman
IPC Rerpairability Committee
On Wed, 1 Nov 2000 15:02:14 -0800, Pelkey, Glenn <[log in to unmask]>
wrote:
>Check out this article...may be useful. No personal experience with it.
>
>Glenn
>
>"The case of the Missing Surface-Mount Pads," J. Ferry. Circuits Assembly,
>June 2000.
>
>htttp://www.circuitsassembly.com
>
>> -----Original Message-----
>> From: Ryu [SMTP:[log in to unmask]]
>> Sent: Wednesday, November 01, 2000 8:20 AM
>> To: [log in to unmask]
>> Subject: [TN] Is it possible to repair BGA pad?
>>
>> During a reballing process, we accidentally removed a pad from the BGA
>> substrate in the cleaning
>> process. Is there any reliable method to attach the pad back to the
>> substrate? or should we
>> re-use the part at all. Thanks .
>
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