TECHNET Archives

November 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Pelkey, Glenn" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Nov 2000 15:02:14 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
Check out this article...may be useful.  No personal experience with it.

Glenn

"The case of the Missing Surface-Mount Pads," J. Ferry.  Circuits Assembly,
June 2000.

htttp://www.circuitsassembly.com

> -----Original Message-----
> From: Ryu [SMTP:[log in to unmask]]
> Sent: Wednesday, November 01, 2000 8:20 AM
> To:   [log in to unmask]
> Subject:      [TN] Is it possible to repair BGA pad?
>
> During a reballing process, we accidentally removed a pad from the BGA
> substrate in the cleaning
> process. Is there any reliable method to attach the pad back to the
> substrate?  or should we
> re-use the part at all.  Thanks .

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2