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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 1 Nov 2000 15:02:14 -0800 |
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Check out this article...may be useful. No personal experience with it.
Glenn
"The case of the Missing Surface-Mount Pads," J. Ferry. Circuits Assembly,
June 2000.
htttp://www.circuitsassembly.com
> -----Original Message-----
> From: Ryu [SMTP:[log in to unmask]]
> Sent: Wednesday, November 01, 2000 8:20 AM
> To: [log in to unmask]
> Subject: [TN] Is it possible to repair BGA pad?
>
> During a reballing process, we accidentally removed a pad from the BGA
> substrate in the cleaning
> process. Is there any reliable method to attach the pad back to the
> substrate? or should we
> re-use the part at all. Thanks .
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