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November 2000

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Nov 2000 08:57:23 +0100
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Tx Steven,
have checked your guidelines, absolutely wonderful, at least in my point of
view, envy you, we have not even a home page for this yet. I have a couple
of your biggest MCMs, the one in upper corner on your web site, with 13
sites for memory chips.I use to show it for telling people how an MCM should
look like..make show for you inside my company! Satisfied?..he-he.  Am
temptated break it an look at your vias, mebbe you are better than the one
we buy from now. Let you know offline 'cause. Anyway, thank you for straight
manner and support.
Ingemar

-----Original Message-----
From: Creswick [mailto:[log in to unmask]]
Sent: den 15 november 2000 04:38
To: [log in to unmask]
Subject: [TN] TN: Lamba for LTCC thermal vias


Ingemar,

I thought we had that covered in our design guide, but I see we are woefully
lacking (go to http://www.ctscorp.com, then Technical Papers, then CTS
Design Guide for LTCC.  Paragraph 3.7 only briefly touches on the subject.)

I will be not "on-line" for a few days, but will see what can be retrieved
for you.  I know that we have done it for in-house designs.  Just don't know
if we have published it.

Will be getting back to you next week.

FYI - We generally stack thermal vias, one on top of the other.  To assure
hermeticity, we stop the stack one tape layer short (leaving the thinest
tape layer to seal the pillar, while inducing the least possible thermal
impedance).

Steven Creswick - CTS

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