Ingemar,

I thought we had that covered in our design guide, but I see we are woefully
lacking (go to http://www.ctscorp.com, then Technical Papers, then CTS
Design Guide for LTCC.  Paragraph 3.7 only briefly touches on the subject.)

I will be not "on-line" for a few days, but will see what can be retrieved
for you.  I know that we have done it for in-house designs.  Just don't know
if we have published it.

Will be getting back to you next week.

FYI - We generally stack thermal vias, one on top of the other.  To assure
hermeticity, we stop the stack one tape layer short (leaving the thinest
tape layer to seal the pillar, while inducing the least possible thermal
impedance).

Steven Creswick - CTS

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