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November 2000

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Subject:
From:
Shirley Xiao <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Nov 2000 16:36:49 -0800
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  Dear Technetters:
  We had numerous discussions about warp & twist
in the past and I am sure there will be more. I saw
ITRI (Interconnection Technology Research Institute)
has some joint research, such as multilayer holewall
wicking (www.itri.org).The ITRI project team really
have all representives from the whole electronics
supply chain,from raw materials to CEM and OEM. Does
anyone know how can we recommend the topic of warp &
twist to ITRI?

  Good luck!

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