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November 2000

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Subject:
Warp/Bow after reflow
From:
Malewicz Wesley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 13 Nov 2000 10:07:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines) 
Hi,

What are some of the contributors that would cause a .040 thick PCB in a 12
up panel, routed and scored, with components mounted on both sides, to
warp/bow after reflow.

Thanking you in advance for your suggestions.

Wes Malewicz
Printed Circuit Development Supervisor
Siemens Medical EM-PCS
email:  [log in to unmask]

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