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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 9 Nov 2000 08:40:05 -0600 |
Content-Type: | text/plain |
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Good morning everyone.
I need some input from you guys. We have a product (pcb assembly) in which
we needed to "press in" a PEM spacer. Unfortunately when we pressed in the
spacer, it has caused stress cracks in the pcb. I have looked in the
IPC-A-610 to find out acceptable and rejectable criteria for stress cracks,
however, I have not been able to find any. The closest I can come is
crazing. However, the defect appears to be more of a stress crack then
crazing.
Need help. Is there any other accept/reject criteria or anyone else
experience with stress cracks from pressing in hardware.
Please advise.
Rich
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