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November 2000

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Subject:
From:
Rich Lasko <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Nov 2000 08:40:05 -0600
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Good morning everyone.

I need some input from you guys.  We have a product (pcb assembly) in which
we needed to "press in" a PEM spacer.  Unfortunately when we pressed in the
spacer, it has caused stress cracks in the pcb.  I have looked in the
IPC-A-610 to find out acceptable and rejectable criteria for stress cracks,
however, I have not been able to find any.  The closest I can come is
crazing.  However, the defect appears to be more of a stress crack then
crazing.

Need help.  Is there any other accept/reject criteria or anyone else
experience with stress cracks from pressing in hardware.

Please advise.

Rich

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