Scott,
In answer to your inquiry about a non-electrolytic surface finish that is
both; wire bondable and solderable, there are two alternatives that are
commercially available.

1-  Ni/Au/Au:
This is electroless Ni ( 120 to 160 uins or 3 to 4 microns) with Immersion
gold (2uins) followed by more immersion gold (10 to 14uins). The second gold
step is executed in a modified immersion bath.  The net result is that you
get a total of 12 to 16 uins or 0.3 to 0.4 microns of gold.
This surface is good for Gold wire bonding and also is solderable with
minimum exposure to gold embrittlement.

2- Ni/Pd/Au:
Here the electroless Nickel surface is coated with 10 to 12 uins of
Electroless palladium. The gold flash is  approximately 1uins. The gold is
there to minimize the catalytic effect at the surface of the Pd.
This surface also gives excellent gold wire bondability and solderability.

George Milad
Technical marketing Manager
Shipley Company
(516)868-8800 ext 269
[log in to unmask]

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