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November 2000

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TechNet <[log in to unmask]>
Subject:
KASE test
From:
"Scott B. Westheimer" <[log in to unmask]>
Date:
Wed, 22 Nov 2000 09:14:23 +0800
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"TechNet E-Mail Forum." <[log in to unmask]>, "Scott B. Westheimer" <[log in to unmask]>
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Can anyone offer some comments on the KASE test which checks for copper
rust. We use an organic coating (OSP) and a pre-flux as a final finish.
Boards are placed in a R/H controled oven and exposed to 2% NaCl during temp
and R/H cycling. My question is what are in the PCB manufaturing processes
that effect the copper ability, with OSP coating applied, to cause the the
formation of rust.

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