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November 2000

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Subject:
MULTILAYER BOARD LAY-UP
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Nov 2000 08:21:54 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Dear Techneters:

I have a six-layer board design which requires three polyimide cores bonded
together with two layers of prepreg.  Our PWB supplier is recommending using
two cores bonded together with prepreg, then bonding copper foil on both
outside layers also using prepreg.  The resultant dielectric thickness'
would remain similar to the original design.  Are there any drawbacks to
this approach?  What is the benefit?

Thanks,
Jim M.

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