The following support explanations are from IPC-HDBK-001:
3.7.1 Environmental Controls (J-STD-001B)
3.6.1 Environmental Controls (IPC/EIA J-STD-001C)
A positive pressure within the soldering facility ensures that the uncontrolled external environment will not enter the area.
3.7.2 Temperature and Humidity (J-STD-001B)
3.6.2 Temperature and Humidity (IPC/EIA J-STD-001C)
The limits given in this paragraph have been accepted as the maximum range for temperature and humidity in which most solder pastes, fluxes, or other solvents will perform as expected while maintaining considerations for control of electrostatic charges and operator comfort. Process control procedures should include modified limits where special materials or processes dictate. Enhanced ESD control procedures may be required if humidity levels drop below 30% RH. For more information on electronic discharge control, see DOD-HDBK-263.
I hesitate to say this because I'll get inundated with requests, but Amendment 1 to the handbook passed ballot and the document is being prepared for printing. It will definately be available at APEX and I suspect we'll have it in stock "around Christmas" but definately not before. The amendment adds support for J-STD-001 Revision C, but the Revision B material was not removed since many companies still have contracts to that document. Jack
==========================================
APEX - the industry's premier trade show in Electronics
Manufacturing, January 16-18, 2001, San Diego, California.
More information on website www.apex2001.org
--------
Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL 60062-6135
[log in to unmask]
847-790-5393
fax 847-509-9798
>>> [log in to unmask] 11/30/00 08:08AM >>>
In a message dated 11/30/2000 6:54:13 AM Central Standard Time,
[log in to unmask] writes:
> Good morning everyone!
>
> Can anyone tell me if there is an industry standard for temperature and
> humidity levels for an electronics production floor? I believe the
> recommended minimum relative humidity level under a good ESD program is
40%.
> We are looking to monitor the temperature and humidity levels in our new
> building but I am unsure of what the upper and lower acceptable limits
> should be. Please advise.
>
> (Please note: as of now we are looking to treat the entire production floor
> as a controlled environment, however in the new building the shipping doors
> are only blocked by those "shipping drapes" which means when they are open
> the outside temperature could play a role in changing the inside
> temperature.)
>
> Rich
Hi Rich!
The J-STD-001 states:
3.7.1 Environmental Controls
The soldering facility should be enclosed, temperature and humidity
controlled, and
maintained at a positive pressure.
3.7.2 Temperature and Humidity
When humidity decreases to a level of 30% or lower, the manufacturer shall
verify that electrostatic discharge control is adequate, and that sufficient
moisture is present for flux performance and solder paste applications. For
operator comfort and solderability maintenance, the temperature should be
maintained between 18º C. and 30º C. and the relative humidity should not
exceed 70%. For process control, more restrictive temperature and humidity
limits may be required.
-Steve Gregory-
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