Earl, are you asking for process suggestions for solder sealing metal
lids to circuits or for alternative to metal lids so soldered?
If the former what is your max process temperature?

Mike Fenner

----- Original Message -----
From: "Earl Moon" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, November 15, 2000 4:48 PM
Subject: [TN] Ceramic to metal and other seals


> As many of you, I have spent time designing, fabricating, and
assembling
> hybrid thick and thin film circuits. Just never found the "perfect"
ceramic
> to metal seal.
>
> Have done Kovar/glass to metal seals as common practice. Have
generally had
> good experiences with epoxy seals.
>
> Now, I'm faced with another "typical" seal type as Alloy
42/solder/solder to
> ceramic with mating metallization.
>
> My question is, considering the difficulty of always soldering
effectively
> to the alloy, what works well? I'm talking here about the "cans"
placed and
> sealed, maybe, to the substrate. Alternatives?
>
> Earl Moon, Proof Of Design
>
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