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November 2000

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"Boldt, Mike (msd) USX" <[log in to unmask]>
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Thu, 2 Nov 2000 13:54:32 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, "Boldt, Mike (msd) USX" <[log in to unmask]>
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Hi Craig,
I don't have a copy of the appropriate IPC spec handy (IPC-2223), but the
venerable MIL-STD-2118 has a Table I that calls out:

0-100 Vdc = .005" for surface conductors and .004" for "encapsulated".
101-300 Vdc = .015" surface and .008" encapsulated (since you're right on
the break point).

The definition of encapsulated is "internal layers bonded together or
external layers with cover coat or potting, as opposed to conformal coating
or soldermask."
Hope this helps.
Mike

Michael E. Boldt
Electronic Packaging Engineer
Moog Inc., Motion Systems Division
East Aurora, New York 14052

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