Dear All
Do you have any information/research/suggestions
concerning the movement of components and mechanical
forces acting upon components during their placement
and during the accelerations of the PCBs in the
Component Placement machines?
I am also interested in any details you may have to
offer concerning the tackiness of solder pastes and
how this relates to the 'shift' of components during
placement and movement of the PCB.
Any information/suggestions (such as test methods or
research details etc.) that may be relavent to the
investigation of these factors will be gratefully
received.
Thanks to all who took the time to read this message,
yours faithfully
Dan Straupe
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