I agree that using the same trace width to connect to both ends of a 0603
package is a good idea. But I haven't bothered.

My 0603 footprint is two 30 mil squares. On the boards I've done, I just been
ran standard traces into them without any teardrops or narrowing. All my
(low-power) analog and digital signal traces are 8 mils, my power (Vdd and GND)
traces are 10 mils.

_Surface-Mount Technology for PC Boards_ by J.K.Hollomon, Jr. (1995) recommends
narrowing traces to 10 mil (maximum) before entering any SMT land. (p. 156). If
you use photo-imaged SMOBC, the direction the traces exit the lands is
irrelevant (p. 159).

Are there any better references available ? A lot has changed in the past 5
years.

( 1 mil = 0.0254 mm).
(SMOBC = solder mask over bare copper)

Mark Mainland asked:
= For manufacturing can anybody tell me what width's they have been using when
going into a 0603 cap?

George Patrick replied
=  .025, more important that the same width is used on both pads.

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