But what specification would this fall under...IPC 6012? A-600? I've reviewed both
and even went back into D-275 to no avail. I did read a paragraph about internal
layers must meet the same criteria for outer layers but nothing close to what I was
expecting to see in these documents.

Any direction from the gang would be wonderful

Franklin

Brooks Bill wrote:

> Hi Frank...
>
> Well... if the board had been laid out properly.... you would not see any
> power or ground where there was a beveled edge...
> The designer of the board should make a minimum clearance around the entire
> board outline to allow a gap between the power/gnd planes and the board
> edge... in the area where there is to be a beveled edge it may need to be a
> greater gap than the rest of the perimeter...
> Most of the board houses I have talked with like to see a .050 min. gap
> between the edge of the board and the internal planes or circuits. Or any
> circuits for that matter... top or bottom. this allows a good adhesion of
> the laminate and prevents shorting between the layers, if the board comes
> into edge contact with any conductive medium. And it's good design
> practice... too. Of course, there are exceptions... edge contacts need to
> come to the edge... etc...  but in the illustration you sent below, these
> are internal planes and should not be exposed by the chamfering process.
>
> Bill Brooks
> Senior PCB Designer - [log in to unmask]
> Zoneworx, Inc.
> 40925 County Center Drive, STE 200
> Temecula, CA 92591
> http://www.zoneworx.com
> Tel: (909) 296-1226 x 1037
> Co-Director / Education Officer / Webmaster
> for the San Diego Chapter of the IPC Designers Council
> http://www.ipc.org/SanDiego/index.html
> http://home.fda.net/bbrooks/pca/
>
> -----Original Message-----
> From: Franklin D Asbell [mailto:[log in to unmask]]
> Sent: Wednesday, October 05, 1988 9:36 AM
> To: [log in to unmask]
> Subject: [TN] Exposed power-ground plane
>
> I need some input from all of you...
>
> What specification provides criteria for power-ground planes being
> exposed due the bevel process, or actually exposed planes for any
> reason?
>
> Or does anyone know the specific criteria, dimension, tolerance, etc for
> this condition.
>
> ----------
> ------------\-   < exposed power layer
> ------------/-   < exposed ground layer
> ----------
>
> Thanks,
>
> Franklin D Asbell
>
> ----------------------------------------------------------------------------
> -----
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF TECHNET
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> ----------------------------------------------------------------------------
> -----
>
> ---------------------------------------------------------------------------------
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF TECHNET
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------

---------------------------------------------------------------------------------
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF TECHNET
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------