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October 2000

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Subject:
FW: IPC-610C & J-STD-001C
From:
Steve Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Oct 2000 15:47:27 -0400
Content-Type:
text/plain
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text/plain (32 lines) 
 -----Original Message-----
From:   Steve Kelly [mailto:[log in to unmask]]
Sent:   Wednesday, October 04, 2000 3:32 PM
To:     [log in to unmask]
Subject:        IPC-610C & J-STD-001C

When both documents are called up on a drawing how does one interpret the
solder ball issue. Section 6.5.3.1 in IPC-610C says 5 solder balls per .093
sq.in. as a process indicator. but the next paragraph says a defect is
present if the solder ball is not attached to a metal surface. I have
trouble interpreting J-STD-001C but I think I read zero solder balls. Thanks
for the help.

Steve Kelly
PFC Flexible Circuits Ltd.
(416) 750-8433
[log in to unmask]

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